Compression Molding solutions for various high end package and cost savings for standard package applications

There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular MAP Package which BGA type substrate and QFN molding to reduce CoO. And achieve to good reliability to each component by no resin...

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Bibliographic Details
Published in2016 International Conference on Electronics Packaging (ICEP) pp. 243 - 247
Main Author Miura, Muneo
Format Conference Proceeding
LanguageEnglish
Published The Japan Institute of Electronics Packaging 01.04.2016
Subjects
Compounds
Compression molding
Presses
Resins
Substrates
Wires
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Summary:There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular MAP Package which BGA type substrate and QFN molding to reduce CoO. And achieve to good reliability to each component by no resin flow. There is wide range of applications including LED production. The system is fully developed and started selling is ready to support for the mass production. Compression Molding is the next Defacto standard product in mold industry.
DOI:10.1109/ICEP.2016.7486820