Thermal humidity reliability criterions for a typical TSV device

As high performance MEMS devices are introducing, MEMS packaging using 3D high density packaging with Through Silicon Vias (TSV) technology becomes attractive. However, different criterions for reliability tests on TSV structures were found without consistency in the literature so that a study on cr...

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Bibliographic Details
Published in2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) pp. 1 - 4
Main Authors Ben-Je Lwo, Chia-Liang Teng, Zi-Yan Huang, Kuo-Hao Tseng, Kun-Fu Tseng
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2016
Subjects
3D high density packaging
Humidity
MEMS packaging
Performance evaluation
Through Silicon Vias (TSV)
TSV reliability
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Summary:As high performance MEMS devices are introducing, MEMS packaging using 3D high density packaging with Through Silicon Vias (TSV) technology becomes attractive. However, different criterions for reliability tests on TSV structures were found without consistency in the literature so that a study on criterion itself becomes necessary. To this end, this paper performed the Temperature Humidity Cycling Test (THCT) on the test samples with two different TSV structures. We next analyzed the experimental data with different failure criterions on relative resistance change to build the Weibull failure curves. After comparing the parameters extracted from the experimental data, effects on using different criterions on TSV reliability tests are discussed.
DOI:10.1109/DTIP.2016.7514850