CIP metrology improving the bump yield in photo-lithography process
With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during four-month record and tracking. Through these effective and analytical efforts, the rework ratio in the abnormal PR coating contribution was decrease...
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Published in | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) pp. 386 - 389 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.10.2015
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Abstract | With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during four-month record and tracking. Through these effective and analytical efforts, the rework ratio in the abnormal PR coating contribution was decreased from 0.29% to 0.19%. The result for the auto misalignment was reduced from 0.23% to 0.13% as well for the repeatable defect from 0.17% to 0.1%. The whole package yield during these three issues was promoted around 0.3%. |
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AbstractList | With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during four-month record and tracking. Through these effective and analytical efforts, the rework ratio in the abnormal PR coating contribution was decreased from 0.29% to 0.19%. The result for the auto misalignment was reduced from 0.23% to 0.13% as well for the repeatable defect from 0.17% to 0.1%. The whole package yield during these three issues was promoted around 0.3%. |
Author | Yu Yi-Hong Mu-Chun Wang Wen-How Lan Wei-Chun Chung Chii-Wen Chen Yu-Wei Wang |
Author_xml | – sequence: 1 surname: Mu-Chun Wang fullname: Mu-Chun Wang organization: Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan – sequence: 2 surname: Wei-Chun Chung fullname: Wei-Chun Chung organization: Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan – sequence: 3 surname: Yu Yi-Hong fullname: Yu Yi-Hong organization: Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan – sequence: 4 surname: Yu-Wei Wang fullname: Yu-Wei Wang organization: Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan – sequence: 5 surname: Chii-Wen Chen fullname: Chii-Wen Chen email: cwchen@must.edu.tw organization: Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan – sequence: 6 surname: Wen-How Lan fullname: Wen-How Lan email: whlan@nuk.edu.tw organization: Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan |
BookMark | eNotj8tqg0AYRqekXTRpniCbeQHNXJzbMkgvQkKzcB9m9FcH1BGdFnz7ljarjwOHA98WPY5hBIQOlKSUEnMsLtdTXqaMUJEqLgXj4gFtaSYV11xItkF7o_QfG2mIeEZ5XlzxAHEOfWhX7IdpDt9-bHHsALuvYcKrh77GfsRTF2JIeh-70M526lb861awLC_oqbH9Avv77lD59lrmH8n5873IT-fEU8ZjosFxbW1dOd0YpZhuVEZsrYQAQhg3FWPGSuIy6qwBo6RlqrbENa7JKsr5Dh3-sx4AbtPsBzuvt_tN_gPDa0rv |
ContentType | Conference Proceeding |
DBID | 6IE 6IL CBEJK RIE RIL |
DOI | 10.1109/IMPACT.2015.7365235 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library (IEL) IEEE Proceedings Order Plans (POP All) 1998-Present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
EISBN | 1467383562 9781467383561 |
EndPage | 389 |
ExternalDocumentID | 7365235 |
Genre | orig-research |
GroupedDBID | 6IE 6IL CBEJK RIE RIL |
ID | FETCH-LOGICAL-i123t-8eb38aadcb8f97728f740ad755e00239c229a60b41ba9e976a27da0bfbf4c133 |
IEDL.DBID | RIE |
ISBN | 9781467396905 1467396907 |
IngestDate | Wed Jun 26 19:25:05 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i123t-8eb38aadcb8f97728f740ad755e00239c229a60b41ba9e976a27da0bfbf4c133 |
PageCount | 4 |
ParticipantIDs | ieee_primary_7365235 |
PublicationCentury | 2000 |
PublicationDate | 20151001 |
PublicationDateYYYYMMDD | 2015-10-01 |
PublicationDate_xml | – month: 10 year: 2015 text: 20151001 day: 01 |
PublicationDecade | 2010 |
PublicationTitle | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
PublicationTitleAbbrev | IMPACT |
PublicationYear | 2015 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
Score | 1.6179203 |
Snippet | With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 386 |
SubjectTerms | Assembly Coatings Gold Integrated circuits Lithography Metrology Monitoring |
Title | CIP metrology improving the bump yield in photo-lithography process |
URI | https://ieeexplore.ieee.org/document/7365235 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV09T8MwFHxqOzEBahHf8sCI0zR14nhEERVFKupQpG6VP2mFSCqUDuXX85yk5UMMbI6HyNYb7s6-dwa4GfqrNYRJOhDcUMa4oEIqg5onQfxiqdBVlNLkKXl4Zo_zeN6C230vjLW2Mp_ZwA-ru3xT6I0_KuvzYYK6KW5DOw2jb71aCR8Kr_J2EU7Nd9ykDA1C0R9PpnfZzFu54qD5zY_3VCo4GR3CZLeQ2kXyGmxKFeiPXxmN_13pEfS-GvfIdA9Jx9CyeReybDwlb9Y70ouXLVntjhEIcj-isJxk621sZJWT9bIoC4rMfNkkWZN13UjQg9nofpY90ObtBLpCLCppiiI5ldJolTqkeFHqOAul4XFsq35WHUVCJqFiAyWFRU4iI25kqJxyTKNuPYFOXuT2FIi1mnGrE-2wesj2hBPCmUSxUBuL8uoMun7_i3WdjrFotn7-9_QFHPga1Ha4S-iU7xt7hbBequuqnp8cAp_r |
link.rule.ids | 310,311,786,790,795,796,802,27956,55107 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV09T8MwFHwqZYAJUIv4xgMjSdPWieMRRVQtNFWHIHWr_BWoEEmF0qH8ep6TtHyIgc3xENl6w93Z984AN317tYYw6XQ50w6ljDtcSI2aJ0D8oiFXZZRSPAmGT_Rh5s8acLvthTHGlOYz49pheZevc7WyR2Ud1g9QN_k7sIs477Fv3VoB63Or8zYhTvW3X-cMdT3eGcXTuyixZi7frX_040WVElAGBxBvllL5SF7dVSFd9fErpfG_az2E9lfrHpluQekIGiZrQRSNpuTNWE96_rwmi81BAkH2RyQWlKytkY0sMrJ8yYvcQW7-UmdZk2XVStCGZHCfREOnfj3BWSAaFU6IMjkUQisZpkjyemHKqCc0831TdrSqXo-LwJO0KwU3yEpEj2nhyVSmVKFyPYZmlmfmBIgxijKjApVi_ZDv8ZTzVAeSekobFFin0LL7ny-rfIx5vfWzv6evYW-YxOP5eDR5PId9W4_KHHcBzeJ9ZS4R5At5Vdb2E7t_oz8 |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2015+10th+International+Microsystems%2C+Packaging%2C+Assembly+and+Circuits+Technology+Conference+%28IMPACT%29&rft.atitle=CIP+metrology+improving+the+bump+yield+in+photo-lithography+process&rft.au=Mu-Chun+Wang&rft.au=Wei-Chun+Chung&rft.au=Yu+Yi-Hong&rft.au=Yu-Wei+Wang&rft.date=2015-10-01&rft.pub=IEEE&rft.isbn=9781467396905&rft.spage=386&rft.epage=389&rft_id=info:doi/10.1109%2FIMPACT.2015.7365235&rft.externalDocID=7365235 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467396905/lc.gif&client=summon&freeimage=true |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467396905/mc.gif&client=summon&freeimage=true |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467396905/sc.gif&client=summon&freeimage=true |