A new release control policy (WRELM) for semiconductor wafer fabrication facilities

Release control plays an important role on the performance of a semiconductor wafer fabrication facility. Comparing to common release control strategies (such as FIFO, EDD, SA, CONWIP, WR, and WIPCTRL), a new workload regulating policy (abbreviated as WRELM), with a dynamic critical value on the bot...

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Bibliographic Details
Published inProceedings of the 11th IEEE International Conference on Networking, Sensing and Control pp. 64 - 68
Main Authors Chen, Z. B., Pan, X. W., Li, L., Chen, Q. J., Xu, W. S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2014
Subjects
dynamic critical value
extreme learning machine
release control
semiconductor manufacturing
workload regulating
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Summary:Release control plays an important role on the performance of a semiconductor wafer fabrication facility. Comparing to common release control strategies (such as FIFO, EDD, SA, CONWIP, WR, and WIPCTRL), a new workload regulating policy (abbreviated as WRELM), with a dynamic critical value on the bottleneck obtained by an extreme learning machine, is proposed. WRELM is validated and verified by a simulation model from a real 6 inch fab. The simulation results show that WRELM improves the throughput by 4.02% and decrease the mean cycle time by 15.40% comparing to those of common WR.
DOI:10.1109/ICNSC.2014.6819601