Practical process flows for monolithic 3D

Three approaches to obtain monolithic 3D logic ICs are presented in this paper. RCAT - Process the high temperature on a generic structure prior to layer transfer (LT), and finish with cold processes; i.e., etch & depositions. Gate Replacement (Gate Last HKMG) - Process the high temperature on a...

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Bibliographic Details
Published in2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) pp. 1 - 2
Main Author Or-Bach, Zvi
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2013
Subjects
Annealing
Heating
Lasers
Logic gates
Silicon
Three-dimensional displays
Transistors
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Summary:Three approaches to obtain monolithic 3D logic ICs are presented in this paper. RCAT - Process the high temperature on a generic structure prior to layer transfer (LT), and finish with cold processes; i.e., etch & depositions. Gate Replacement (Gate Last HKMG) - Process the high temperature on a repeating structure prior to LT, and finish with `gate replacement' cold processes. Laser Annealing - Use short laser pulses to locally heat and anneal the top layer while protecting the interconnection layers below from the topside heat. These approaches utilize well-known and manufacturing-friendly materials, process steps and device structures.
ISSN:1078-621X
2577-2295
DOI:10.1109/S3S.2013.6716512