Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application

In this paper, a cooling concept for power electronics is discussed, using thermo-electric cooling in combination with a phase-change based latent heat storage module. It was designed to cope with thermal transients due to periodic overload operation phases of an IGBT power converter module. Several...

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Bibliographic Details
Published in2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) pp. 1 - 7
Main Authors Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Ras, M. Abo, Oppermann, H., Xhonneux, T., Caroff, T., Mitova, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2015
Subjects
Cooling
Heating
Junctions
Phase change materials
Testing
Thermal conductivity
Thermal resistance
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Summary:In this paper, a cooling concept for power electronics is discussed, using thermo-electric cooling in combination with a phase-change based latent heat storage module. It was designed to cope with thermal transients due to periodic overload operation phases of an IGBT power converter module. Several sub-system simulations and experiments have already been performed in previous publications leading to the current design state, which is now being tested under emulated experimental conditions. Very good results are presented, showing the feasibility of the transient cooling concept. On-going work referred to the long-term thermal stability and operation as well as a smart electrical TEC control will be motivated.
DOI:10.1109/THERMINIC.2015.7389638