HDL simulation model for testing and verification of "system in package" sensor architectures

The recent advances in micro electro-mechanical systems (MEMS) technology allowed manufacturers to integrate in one package/chip the sensor together with one or more IC's of different functionality resulting the so called system in package (SiP). Those advances combined with the latest improvem...

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Bibliographic Details
Published in2023 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE) pp. 1 - 4
Main Authors Radoi, Ionut, Dobrescu, Lidia, Rusea, Cosmin
Format Conference Proceeding
LanguageEnglish
Published IEEE 23.03.2023
Subjects
Computer architecture
Data models
FPGA
Micromechanical devices
Reconfigurable devices
sensor
Software
Software algorithms
System-in-package
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Summary:The recent advances in micro electro-mechanical systems (MEMS) technology allowed manufacturers to integrate in one package/chip the sensor together with one or more IC's of different functionality resulting the so called system in package (SiP). Those advances combined with the latest improvements on hardware reconfigurable devices, made it possible for engineers to combine this two technologies in developing new sensing architectures, sensor calibration models or data fusion algorithms, etc. In development stage engineers often need simulation models who can describe as accurate as possible the behavior real device to user defined stimulus. In this paper is presented a HDL simulation model designed to help hardware or software designers in developing and testing new sensor solutions and also improving the existing one.
ISSN:2159-3604
DOI:10.1109/ATEE58038.2023.10108271