A Novel Continuous Plasma Etch with Optimized Algorithms for Yield Improvement and High Production Throughput in NOR Memory

In NOR memory device, there was massive yield loss of more than 10% caused by missing contacts in a multi-layer resist (MLR) contact etch process. We have developed a novel continuous plasma process (CPP) combined with new endpoint algorithms to fix the missing contact issue. We present the investig...

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Bibliographic Details
Published in2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) pp. 1 - 5
Main Authors Ye, Jeff J., Lu, Fei, Sheng, Haifeng, Singh, Param
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2023
Subjects
continuous plasma process
Low-pass filters
missing contacts
Motion pictures
Product design
Production
raw process time
Resists
Semiconductor device manufacture
Throughput
yield improvement
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Summary:In NOR memory device, there was massive yield loss of more than 10% caused by missing contacts in a multi-layer resist (MLR) contact etch process. We have developed a novel continuous plasma process (CPP) combined with new endpoint algorithms to fix the missing contact issue. We present the investigation of root cause using etch movies at the hardmask (HM) step. Later, we show results from applying the novel CPP combined with new endpoint algorithms at two HM steps. This approach significantly improved process margin by eliminating missing contact issue and also reduced raw process time (RPT) by 4.8% for better production throughput.
ISSN:2376-6697
DOI:10.1109/ASMC57536.2023.10121134