Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement

Fan-Out Wafer Level Packaging (FOWLP) can be a good candidate for heterogeneous integration of Photonic ICs (PIC) and Electronic ICs (EIC) in the same package to achieve low interconnect loss, low power consumption, and small factor for optical communications requiring high data transmission. The ve...

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Published in2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) pp. 664 - 668
Main Authors Jiaqi, Wu, Guan, Lim Teck, Tsung-Yang Liow, Jason, Nair Gourikutty, Sajay Bhuvanendran
Format Conference Proceeding
LanguageEnglish
Published IEEE 05.12.2023
Subjects
Multichip modules
Optical fiber communication
Optical losses
Power demand
Propagation losses
Radio frequency
Routing
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Summary:Fan-Out Wafer Level Packaging (FOWLP) can be a good candidate for heterogeneous integration of Photonic ICs (PIC) and Electronic ICs (EIC) in the same package to achieve low interconnect loss, low power consumption, and small factor for optical communications requiring high data transmission. The vertical interconnects Through Mold Via (TMV) in FOWLP can be utilized for the RF routing from frontside to backside vertically. The conventional way of characterizing the RF performance of vertical interconnects is to de-embed the vertical section by measuring a back-to-back structure with multiple de-embedding structures. In this paper, differential TMV structures in GSSG configuration are characterized by direct measurement using double-side probing techniques from DC to 50GHz. Three GSSG TMV interconnects with different TMV pitches are measured and compared. The 100Gbps PAM4 eye diagrams of the interconnects are also shown.
DOI:10.1109/EPTC59621.2023.10457916