Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm

• Published in: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) pp. 1625 - 1628
• Main Authors: Liu, Yi, Yuan, Shuoxun, Zhang, Jin, Zhang, Zhewei, Zhang, Lei, Gong, Hongzhou, Wang, Laili, Gao, Kai
• Format: Conference Proceeding
• Language: English
• Published: IEEE 17.05.2024
• Subjects: Finite element analysis; Junctions; long short term memory; Neural networks; Reliability; Solid modeling; Temperature distribution; Thermal management; Three dimensional; transient temperature distribution

Thermal management of power devices has always been the subject of research. A three-dimensional thermal modeling method is proposed in this paper. Firstly, based on the principles of finite element analysis (FEA), the dataset of heat sources and temperatures is established. Secondly, time-dependent...