Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm

Thermal management of power devices has always been the subject of research. A three-dimensional thermal modeling method is proposed in this paper. Firstly, based on the principles of finite element analysis (FEA), the dataset of heat sources and temperatures is established. Secondly, time-dependent...

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Bibliographic Details
Published in2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) pp. 1625 - 1628
Main Authors Liu, Yi, Yuan, Shuoxun, Zhang, Jin, Zhang, Zhewei, Zhang, Lei, Gong, Hongzhou, Wang, Laili, Gao, Kai
Format Conference Proceeding
LanguageEnglish
Published IEEE 17.05.2024
Subjects
Finite element analysis
Junctions
long short term memory
Neural networks
Reliability
Solid modeling
Temperature distribution
Thermal management
Three dimensional
transient temperature distribution
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Summary:Thermal management of power devices has always been the subject of research. A three-dimensional thermal modeling method is proposed in this paper. Firstly, based on the principles of finite element analysis (FEA), the dataset of heat sources and temperatures is established. Secondly, time-dependent long short term memory (LSTM) neural network is used to achieve prediction of transient temperature distribution. Finally, the three-dimensional thermal distribution of the chip is predicted by using FEA. The proposal of this method can provide a beneficial reference value for the stress of chips and solder layers, because there is a temperature gradient in three-dimensional temperature.
DOI:10.1109/IPEMC-ECCEAsia60879.2024.10568029