APA (7th ed.) Citation

Liu, Y., Yuan, S., Zhang, J., Zhang, Z., Zhang, L., Gong, H., . . . Gao, K. (2024, May 17). Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm. 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 1625-1628. https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568029

Chicago Style (17th ed.) Citation

Liu, Yi, Shuoxun Yuan, Jin Zhang, Zhewei Zhang, Lei Zhang, Hongzhou Gong, Laili Wang, and Kai Gao. "Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm." 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) 17 May. 2024: 1625-1628. https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568029.

MLA (9th ed.) Citation

Liu, Yi, et al. "Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm." 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 17 May. 2024, pp. 1625-1628, https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568029.