Fabrication Techniques for Multi-Layer Printed Flexible Hybrid Sensor Systems

• Published in: IEEE International Conference on Flexible and Printable Sensors and Systems (Online) pp. 1 - 4
• Main Authors: Kachhadiya, Jeneel Pravin, Andrews, Joseph
• Format: Conference Proceeding
• Language: English
• Published: IEEE 09.07.2023
• Subjects: Additives; Bending; Fabrication; Flexible Electronics; Kinematic Sensing; Multi-Layer Printing; Printed Electronics; Resistance; Sensor systems; Sensors; Three-dimensional printing
• ISSN: 2832-8256
• DOI: 10.1109/FLEPS57599.2023.10220387

Additive manufacturing can revolutionize circuit fabrication and enable printed electronics. Flexible circuits made using this technology can be used in wearable or conformable electronic sensing systems. However, fabricating practical circuits with multi-layer interconnects or VIAs using additive techniques and flexible substrates is challenging. To address this issue, we evaluate four different methods for fabricating VIAs in flexible printed circuits, including soldered, printed, conductive epoxy, and zero-ohm jumper VIAs. We subject the circuits to different levels of bending strains and measure changes in conductive properties and mechanical integrity to validate each method. Printed VIAs exhibit the most ideal properties compared to other methods, with a baseline resistance of approximately 0.9 Ohms and a change of approximately 7% when subjected to a bending radius of 12 mm. We use printed VIAs to manufacture a fully conformable impact sensing system that can be adhered to a sports ball, demonstrating their effectiveness. This highlights the utility of multi-layer flexible PCB fabrication using additive printing technology.