APA (7th ed.) Citation

Ghaffarian, R., & Meilunas, M. (2023, May 30). Reliability of BGAs and Mixed Low Temperature Solder Assemblies. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1-8. https://doi.org/10.1109/ITherm55368.2023.10177552

Chicago Style (17th ed.) Citation

Ghaffarian, Reza, and Michael Meilunas. "Reliability of BGAs and Mixed Low Temperature Solder Assemblies." InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 30 May. 2023: 1-8. https://doi.org/10.1109/ITherm55368.2023.10177552.

MLA (9th ed.) Citation

Ghaffarian, Reza, and Michael Meilunas. "Reliability of BGAs and Mixed Low Temperature Solder Assemblies." InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 30 May. 2023, pp. 1-8, https://doi.org/10.1109/ITherm55368.2023.10177552.