Reliability of BGAs and Mixed Low Temperature Solder Assemblies

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability (HR) and the other for commercial applications. For HR, it presents the effect of isothermal aging at BGA component level to address a burn-in requirement for die screening per M...

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Bibliographic Details
Published inInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems pp. 1 - 8
Main Authors Ghaffarian, Reza, Meilunas, Michael
Format Conference Proceeding
LanguageEnglish
Published IEEE 30.05.2023
Subjects
ball grid array
BGA
burn-in
Electronic packaging thermal management
Failure analysis
Hybrid assembly
Industries
Isothermal aging
Lead
lead-free solder
low temperature solder
SAC305
SnBiAg
Temperature distribution
Thermomechanical processes
tin-lead solder
Transmission line matrix methods
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ISSN2694-2135
DOI10.1109/ITherm55368.2023.10177552

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Summary:This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability (HR) and the other for commercial applications. For HR, it presents the effect of isothermal aging at BGA component level to address a burn-in requirement for die screening per Military standard specification. Pull and shear behavior of BGAs with tin-lead and SAC305 solder balls were presented for fresh and burn-in conditions ( 125^{\circ}\mathrm{C} and 150^{\circ}\mathrm{C} for 240 hr). These were assembled onto PCBs and then subject to thermal cycling (TC) between 40^{\circ}\mathrm{C} and 105^{\circ}\mathrm{C} . Cycles-to-failures (CTFs) in Weibull plots were presented for the SnPb CABGA208 assemblies with micro-sectioned images, The commercial aspect covered low temperature solder ball and solder paste for assembling BGAs and other components. Two types of low temperature BiSn alloys, either Cu/Ni or Ag additives and with 139^{\circ}\mathrm{C}/174^{\circ}\mathrm{C} solidus/liquidus temperatures, were evaluated. The mixed hybrid configuration utilized SAC305 BGAs using the SnBiAg solder paste. The low temperature assemblies were subjected to two TCs (-40^{\circ}\mathrm{C}/105^{\circ}\mathrm{C} and 0^{\circ}\mathrm{C}/105^{\circ}\mathrm{C}) . CTF results are presented for CABGA208 with failure analysis by X -sectional evaluation.
ISSN:2694-2135
DOI:10.1109/ITherm55368.2023.10177552