Micron-Scale Silver Flake Paste Sintering Without Pressure for Power Electronic Die Attachment

With the development of power electronics, metal particle sintering, especially Ag particle sintering technology has gained much attentions. In this work, different sintering parameters such as sintering time, temperature and assisted pressure were taken into consideration to evaluate the performanc...

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Bibliographic Details
Published in2021 22nd International Conference on Electronic Packaging Technology (ICEPT) pp. 1 - 4
Main Authors Huang, Shijun, Luo, Ruidong, Wu, Zhen, Li, Cai-Fu
Format Conference Proceeding
LanguageEnglish
Published IEEE 14.09.2021
Subjects
Atmosphere
Mechanical factors
Micrometers
Micron-scale silver flake paste
Microstructure
Packaging
Power electronics
Shear strength
Silver
Temperature
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Summary:With the development of power electronics, metal particle sintering, especially Ag particle sintering technology has gained much attentions. In this work, different sintering parameters such as sintering time, temperature and assisted pressure were taken into consideration to evaluate the performances of micron-scale Ag flake paste. The shear strength of the sintered joints prepared with micron-scale silver flake paste reached as high as 26.5 MPa after sintering at 250°C for 30 min without pressure under atmosphere condition.
DOI:10.1109/ICEPT52650.2021.9568024