Advanced Black Resist Processing and Optimized Lithographic Patterning for Novel Photonic Devices

CMOS image sensors technology is nowadays widely used in various applications due to multiple advantages, such as low cost, low power consumption, on chip functionality, high-speed of operation [1]. The market for CMOS image sensor (CIS) technology is continuously growing, as this technology is key...

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Published in2019 International Wafer Level Packaging Conference (IWLPC) pp. 1 - 6
Main Authors Matuskova, B., Taguchi, H., Weinhart, M., Holly, R., Brunnbauer, M., Rimbock, J., Zenger, T., Eibelhuber, M., Uhrmann, T., Taguchi, Y.
Format Conference Proceeding
LanguageEnglish
Published SMTA 01.10.2019
Subjects
black matrix
black resist
Coatings
lens shielding
Optical surface waves
photonic applications
Resists
Rough surfaces
spin coating
spray coating
Surface roughness
Surface topography
Surface treatment
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Summary:CMOS image sensors technology is nowadays widely used in various applications due to multiple advantages, such as low cost, low power consumption, on chip functionality, high-speed of operation [1]. The market for CMOS image sensor (CIS) technology is continuously growing, as this technology is key technology in the most of the main electronic megatrends, such as smart automotive, portable & mobile electronics, novel human machine interfaces for AR/ VR devices, 3D sensing or \mu -displays and advanced healthcare requirements. In order to follow and continue CIS scaling for thinner and smaller devices, an adoption of new processes and materials is required. Mainly improving optical performance as well as imagining characteristics of image sensors, such as higher image resolution, better contrast and desired optical density of the colored resist materials are key aspects of today's development.
DOI:10.23919/IWLPC.2019.8914139