Study on Discharge Decomposition Characteristics of Environmental-friendly Insulating Medium C5F10O

Environmental-friendly insulating medium C 5 F 10 O has attracted wide attention due to its good insulation properties, but there are still few researches on the discharge decomposition of C 5 F 10 O. Based on density functional theory, the discharge decomposition characteristics of C 5 F 10 O are s...

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Published in2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE) pp. 1 - 4
Main Authors Zhang, Ranzhi, Lin, Xin, Zhong, Jianying, Xu, Jianyuan, Yao, Yongqi, Zhang, Jia, Han, Guohui, Ma, Fengxaing
Format Conference Proceeding
LanguageEnglish
Published IEEE 06.09.2020
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Summary:Environmental-friendly insulating medium C 5 F 10 O has attracted wide attention due to its good insulation properties, but there are still few researches on the discharge decomposition of C 5 F 10 O. Based on density functional theory, the discharge decomposition characteristics of C 5 F 10 O are simulated in this paper. Firstly, the possible discharge decomposition paths of C 5 F 10 O are analyzed and the energy required for different decomposition paths is calculated. Secondly, the synthetic path of C 5 F 10 O decomposition products is discussed, and the energy variation of the synthesis pathway is calculated. Finally, the ionization parameters of C 5 F 10 O discharge decomposition products were calculated and the insulation properties were analyzed. The results show that the C-C bond in the molecular structure of C 5 F 10 O is the most likely to break, and the process of C 5 F 10 O discharge decomposition to form CF 3 CFCOCF 3 ·and CF 3 · radical is the most likely to occur. In the decomposition products of C 5 F 10 O, C2F6, C 5 F 10 and CF4 are easy to be generated, while C3F6, C6F14 and C 3 F 8 are relatively difficult to be generated. The ionization energy of C 5 F 10 O discharge decomposition products is greater than 11eV, which has a strong insulating ability, certain insulation strength can be guaranteed in GIS/GIL.
ISSN:2474-3852
DOI:10.1109/ICHVE49031.2020.9279723