Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing

High bandwidth memory (HBM) has overcome the limitations of conventional DRAMs. It can support terabyte/s data transmission between GPU and HBMs with 2.5D packaging technology. To ensure the high-speed data transmission between the HBM and GPU, the signal integrity (SI) of the HBM interposer with ma...

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Bibliographic Details
Published in2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) pp. 369 - 373
Main Authors Kangrong, Li, Umralkar, Ratan Bhimrao
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.12.2021
Subjects
Conferences
Data communication
Foundries
Graphics processing units
Packaging
Probes
Systematics
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Summary:High bandwidth memory (HBM) has overcome the limitations of conventional DRAMs. It can support terabyte/s data transmission between GPU and HBMs with 2.5D packaging technology. To ensure the high-speed data transmission between the HBM and GPU, the signal integrity (SI) of the HBM interposer with many I/O interconnects needs to be tested with the customized fine-pitch probe card. However, SI problem is found on the probe card when the full-wafer SI test is performed on the HBM interposer. This paper demonstrates that the SI of the probe card for HBM interposer testing needs to be considered. Moreover, this paper introduces a comprehensive methodology to discover and localize the SI problem in the HBM interposer testing through the systematic SI analysis.
DOI:10.1109/EPTC53413.2021.9663999