Q-band micro-patch antennas implemented on a high resistivity silicon substrate using the surface micromachining technology

Using the surface micromachining technology composed of thick photoresist patterning and Cu-metal plating process, Q-band micro-patch antennas were implemented on high resistivity silicon (HRS) substrate. Because the application frequency is sufficiently high, the monolithically integrated, miniatur...

Full description

Saved in:
Bibliographic Details
Published in2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535) Vol. 2; pp. 1189 - 1192 Vol.2
Main Authors HA, Man-Lyun, CHO, Yong-Heui, PYO, Cheol-Sig, KWON, Young-Se
Format Conference Proceeding
LanguageEnglish
Published Piscataway NJ IEEE 2004
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Using the surface micromachining technology composed of thick photoresist patterning and Cu-metal plating process, Q-band micro-patch antennas were implemented on high resistivity silicon (HRS) substrate. Because the application frequency is sufficiently high, the monolithically integrated, miniaturized micro antennas find applications in many systems. 42-GHz micro-patch antennas were fed by the coupling from the micro-strip feeder under the patch part. Using the parasitic capacitance in the posts contacted with HRS substrate, the patch sizes were decreased with slight decreasing of the bandwidth of antennas. Implemented patch antennas have 3 or 4 posts and their size was decreased with the increasing post capacitance in the radiating edges. Implemented patch sizes were 2.12, 1.78, and 1.41-mm with rectangular shape and the measured bandwidth under -10 dB of S11 was about 6 GHz(/spl sim/15%) with center frequency of 41.5 GHz in the case of 2.12 mm patch length.
ISBN:0780383311
9780780383319
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2004.1339199