The evaluation method for ESD immunity of components in terms of soft error

A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming...

Full description

Saved in:
Bibliographic Details
Published in10th International Symposium on Electromagnetic Compatibility pp. 468 - 471
Main Authors Jaedeok Lim, Jongsung Lee, Byongsu Seol, Nandy, A., Pommerenke, D.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2011
Subjects
Component-level
Electrostatic discharge
ESD
Frequency measurement
IEC standards
Immunity testing
Semiconductor device measurement
Soft-error
Voltage measurement
Online AccessGet full text

Cover

More Information
Summary:A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.
ISBN:1457717093
9781457717093
ISSN:2325-0356