Powder LSI: an ultra small RF identification chip for individual recognition applications

A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance b...

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Bibliographic Details
Published in2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC pp. 398 - 501 vol.1
Main Authors Usami, M., Sato, A., Sameshima, K., Watanabe, K., Yoshigi, H., Imura, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Circuits
Clocks
CMOS process
Costs
Electrodes
Large scale integration
MOS capacitors
Powders
Radio frequency
Radiofrequency identification
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Summary:A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.
ISBN:9780780377073
0780377079
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.2003.1234354