C2W bonding method for MEMS applications

A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sea...

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Bibliographic Details
Published in2008 10th Electronics Packaging Technology Conference pp. 1283 - 1287
Main Authors Kelvin, Chen Wei Sheng, Premachandran, C.S., Kyoung, Choi Won, Ling, Ong Siong Chiew Xie, Ratmin, Ahmad Khairyanto Bin, Pa, Myo Ei Pa, Lau, John
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2008
Subjects
Application specific integrated circuits
Bonding processes
Consumer electronics
Electronics packaging
Integrated circuit interconnections
Integrated circuit technology
Microelectromechanical devices
Micromechanical devices
Temperature
Wafer bonding
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Summary:A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sealed with a cap wafer. The sealed package is characterized for hermeticity and shear strength and found to meet the minimum requirements for a good sealing and bonding.
ISBN:9781424421176
1424421179
DOI:10.1109/EPTC.2008.4763607