Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation

SiP (System-in-Package) solution realizes an extremely small sized system which is suitable for mixed-signal mobile applications. However, integration of digital and RF dies with a number of interconnections between them within limited area can cause noise coupling from digital circuits to RF circui...

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Bibliographic Details
Published in2008 10th Electronics Packaging Technology Conference pp. 1387 - 1392
Main Authors Jiwoo Pak, Myunghyun Ha, Jaemin Kim, Donghee Kang, Ho Choi, Seyoung Kwon, Keunsoo La, Joungho Kim
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2008
Subjects
Circuit noise
Coupling circuits
Design methodology
Digital circuits
Digital multimedia broadcasting
Integrated circuit interconnections
Multimedia systems
Noise level
Radio frequency
Stacking
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Summary:SiP (System-in-Package) solution realizes an extremely small sized system which is suitable for mixed-signal mobile applications. However, integration of digital and RF dies with a number of interconnections between them within limited area can cause noise coupling from digital circuits to RF circuits. In this paper, a fully operating T-DMB (Terrestrial Digital Multimedia Broadcasting) system is implemented in a form of a 3-D (three-dimensional) SiP by stacking dies, on which a series of design methodologies to improve the noise isolation level between digital and RF signals, is applied. As a result, the size of system is reduced to 10mm x 10mm, which is the smallest size for full T-DMB system with multimedia, and RF sensitivity is enhanced by 17dB and 45dB for band-3(173-240MHz) and L-band (1.452~1.492GHz), respectively.
ISBN:9781424421176
1424421179
DOI:10.1109/EPTC.2008.4763625