Novel nanospring interconnects for high-density applications

A new cantilevered structure, called the nanospring, is being developed to enable a fine-pitch, high density I/O architecture for the next generation chip and probing technology. This technology meets the requirements of the National Technology Roadmap for Semiconductors (NTRS) for 2012 and beyond....

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Bibliographic Details
Published inProceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) pp. 372 - 378
Main Authors Lunyu Ma, Qi Zhu, Sitaraman, S.K., Chua, C., Fork, D.K.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2001
Subjects
Application software
Compressive stress
Costs
Electronic packaging thermal management
Fabrication
Nanostructures
Tensile stress
Testing
Thermal stresses
Vehicles
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Summary:A new cantilevered structure, called the nanospring, is being developed to enable a fine-pitch, high density I/O architecture for the next generation chip and probing technology. This technology meets the requirements of the National Technology Roadmap for Semiconductors (NTRS) for 2012 and beyond. Based on its unique structure, a new contact mode of sliding contact with no solder is being tested. To understand the reliability of the package with this novel compliant structure and the typical behavior of sliding contacts, test vehicles with different orientations of the nanospring (21 /spl mu/m pitch) have been fabricated, assembled and subjected to thermal cycling tests. In-situ resistance and temperature measurements have been conducted.
ISBN:9780930815646
0930815645
DOI:10.1109/ISAOM.2001.916604