Industrial fabrication technology for CMOS infrared sensor arrays

We report a new technology for the industrial fabrication of CMOS infrared sensor arrays on suspended membranes. Gold lines made with the bumping technology of the IC manufacturer are used to thermally separate the sensor pixels. Further, the buckling problem of CMOS dielectric membranes was solved...

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Bibliographic Details
Published inProceedings of International Solid State Sensors and Actuators Conference (Transducers '97) Vol. 1; pp. 205 - 208 vol.1
Main Authors Munch, U., Jaeggi, D., Schneeberger, K., Schaufelbuhl, A., Paul, O., Baltes, H., Jasper, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1997
Subjects
Biomembranes
CMOS technology
Dielectrics
Fabrication
Gold
Infrared sensors
Manufacturing industries
Sensor arrays
Textile industry
Thermal sensors
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Summary:We report a new technology for the industrial fabrication of CMOS infrared sensor arrays on suspended membranes. Gold lines made with the bumping technology of the IC manufacturer are used to thermally separate the sensor pixels. Further, the buckling problem of CMOS dielectric membranes was solved by finding an oxynitride passivation suitable for the fabrication of low-stress membranes. Finally, the influence of bulk crystal defects on the lateral back mask underetching was studied.
ISBN:9780780338296
0780338294
DOI:10.1109/SENSOR.1997.613619