3-D extraction techniques for signal integrity analysis

In this survey paper we describe recently developed techniques for 3-D extraction of complicated interconnect structures which are both fast and sufficiently accurate to perform signal integrity analysis.

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Bibliographic Details
Published inProceedings of the IEEE 1995 Custom Integrated Circuits Conference pp. 379 - 382
Main Authors Chou, M., Kamon, M., Nabors, K., Phillips, J., White, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1995
Subjects
Capacitance
Circuit simulation
Conductors
Coupling circuits
Equivalent circuits
Integral equations
Integrated circuit interconnections
Magnetic analysis
Packaging
Signal analysis
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Summary:In this survey paper we describe recently developed techniques for 3-D extraction of complicated interconnect structures which are both fast and sufficiently accurate to perform signal integrity analysis.
ISBN:9780780325845
0780325842
DOI:10.1109/CICC.1995.518207