High precision solder droplet printing technology: principle and applications

Solder droplet printing technology, which is low-cost, noncontact, flexible, data-driven, and environmentally friendly, has emerged as an enabling technology for precisely placing fine solder deposits on a variety of small substrates. It is suitable for a variety of applications including direct chi...

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Bibliographic Details
Published inProceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) pp. 104 - 109
Main Authors Qingbin Liu, Leu, M.C., Orme, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2001
Subjects
Aerospace engineering
Costs
Electronics packaging
Integrated circuit packaging
Integrated circuit technology
Lithography
Manufacturing
Microelectronics
Packaging machines
Printing
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Summary:Solder droplet printing technology, which is low-cost, noncontact, flexible, data-driven, and environmentally friendly, has emerged as an enabling technology for precisely placing fine solder deposits on a variety of small substrates. It is suitable for a variety of applications including direct chip attach site preparation, 3D substrates, fine line interconnect, substrate via fill, optoelectronics and many others. It enables manufacturing techniques that are impossible or unfeasible with current technology, such as localized replacement of solder on board, depositing solder in different thicknesses on the same board, or using more than one type of solder on the same board. This makes the evaluation of solder droplet printing technology essential for the microelectronics industry. In this paper, the principle of the solder droplet printing technology is described, recent experimental results are included, and potential applications of the technology in the microelectronics industry are evaluated.
ISBN:9780930815646
0930815645
DOI:10.1109/ISAOM.2001.916557