Thermal modelling of multiple die packages

Various aspects of the dynamic thermal modelling of multiple die packages are discussed in the paper. After a short literature review of the subject the structure function based thermal modelling is presented briefly with an example that was measured in a package, containing stacked dies. The second...

Full description

Saved in:
Bibliographic Details
Published inProceedings of 7th Electronics Packaging Technology Conference (EPTC 2005) : 7-9 December, 2005, Grand Copthorne Waterfront, Singapore Vol. 2; p. 5 pp.
Main Authors Szabo, P., Renez, M., Szekely, V., Poppe, A., Farkas, G., Courtois, B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Equations
Frequency dependence
Impedance
Packaging
Silicon
Steady-state
Switches
Temperature
Thermal conductivity
Thermal resistance
Online AccessGet full text

Cover

More Information
Summary:Various aspects of the dynamic thermal modelling of multiple die packages are discussed in the paper. After a short literature review of the subject the structure function based thermal modelling is presented briefly with an example that was measured in a package, containing stacked dies. The second part of the paper present the new concept of multiport modelling of multiple die packages, where each port is assigned to a die in the package. We demonstrate with experimental results, that the proposed frequency dependent Z th thermal impedance matrix representation of the multiple die packages provides a very informative characterisation of the dynamic thermal behaviour of these packages
ISBN:0780395786
9780780395787
DOI:10.1109/EPTC.2005.1614459