Copper Large-Scale Grain Growth by UV Nanosecond Pulsed Laser Annealing

UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surr...

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Bibliographic Details
Published in2021 IEEE International Interconnect Technology Conference (IITC) pp. 1 - 3
Main Authors Tabata, Toshiyuki, Raynal, Pierre-Edouard, Roze, Fabien, Halty, Sebastien, Thuries, Louis, Cristiano, Fuccio, Scheid, Emmanuel, Mazzamuto, Fulvio
Format Conference Proceeding
LanguageEnglish
Published IEEE 06.07.2021
Subjects
Annealing
BEOL
Conductivity
Conferences
Copper
grain growth
Grain size
laser anneal
Surface emitting lasers
Surface resistance
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Summary:UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 μm and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced.
ISSN:2380-6338
DOI:10.1109/IITC51362.2021.9537312