RC delay mitigation for sub 700 nm hybrid bonding pitch

Hybrid bonding is one of the most scalable 3D integration methods allowing very high interconnect density. The bonding pitch reduction leads to an increase in both resistance and capacitance of this interconnect level. A minimization of the RC delay can be achieved with interconnect adaptation for s...

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Published in2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) pp. 396 - 403
Main Authors Lhostis, Sandrine, Ayoub, Bassel, Fremont, Helene, Moreau, Stephane, Mermoz, Sebastien, Deloffre, Emilie, Souchier, Emeline, Cacho, Maria Gabriela Gusmao, Aybeke, Ece, Lamontagne, Patrick, Rey, Christelle, Tournier, Arnaud
Format Conference Proceeding
LanguageEnglish
Published IEEE 05.12.2023
Subjects
Bonding
Capacitance
Delays
Minimization
Resistance
Shape
Three-dimensional integrated circuits
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DOI10.1109/EPTC59621.2023.10457882

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Summary:Hybrid bonding is one of the most scalable 3D integration methods allowing very high interconnect density. The bonding pitch reduction leads to an increase in both resistance and capacitance of this interconnect level. A minimization of the RC delay can be achieved with interconnect adaptation for sub 700 nm hybrid bonding pitch.
DOI:10.1109/EPTC59621.2023.10457882