Busbar Design: How to Spare Nanohenries ?

This paper intends to compare the many different solutions available to design a busbar interconnection. Starting from a single copper plate and going to multilayer busbars, the influence of the external shape of the sheet, of the number and the nature of holes and apertures are considered. Simulati...

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Bibliographic Details
Published inConference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting Vol. 4; pp. 1865 - 1869
Main Authors Guichon, J.M., Aime, J., Schanen, J.L., Martin, C., Roudet, J., Clavell, E., Arpilliere, M., Pasterczyk, R., Le Floch, Y.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2006
Subjects
Apertures
Assembly
Copper
Geometry
Impedance
Inductance
Integrated circuit interconnections
Nonhomogeneous media
Power electronics
Shape
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Summary:This paper intends to compare the many different solutions available to design a busbar interconnection. Starting from a single copper plate and going to multilayer busbars, the influence of the external shape of the sheet, of the number and the nature of holes and apertures are considered. Simulations and measurements are used to determine the stray inductance of the different busbars. Design rules are deduced from the many case studies, based on industrial examples
ISBN:9781424403646
1424403642
ISSN:0197-2618
2576-702X
DOI:10.1109/IAS.2006.256790