Mechanical characterization of the IMC layer by using Nano-indentation tests

The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated pri...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 1077 - 1079
Main Authors Yuan Guozheng, Li Zhigang, Shu Xuefeng
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Copper
IMC
Lead
Materials
Mechanical factors
nano-indentation
Packaging
Reliability
SAC solder
Surface topography
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ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582726

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Summary:The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic Compound, which is between lead-free solder Sn3.OAg0.5Cu and Cu-pad, were measured by using nano-indentation tests, while the load-displacement curves, displacement-elastic modulus curve and displacement-hardness curves were recorded. Modulus and hardness of these IMCs were characterized by Nano-indentation CSM from plan view in this study. Basing on these experimental data, The calculation of modulus and hardness for IMC layers was based on nano-indentation CSM test results and was compared with reported results.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582726