Development of automated contact inspection system using in-line CD SEM

• Published in: 2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) pp. 399 - 401
• Main Authors: Sang-Mun Chon, Sang-Bong Choi, Yong-Wan Kim, Kye-Weon Kim, Kyu-Hong Lim, Sun-Yong Choi, Chung-Sam Jun
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2001
• Subjects: Automatic optical inspection; Computerized monitoring; Contacts; Data processing; Electron optics; Etching; Optical design; Process design; Scanning electron microscopy; Throughput
• ISBN: 0780367316; 9780780367319
• DOI: 10.1109/ISSM.2001.962999

We have developed an automated contact inspection system using an in-line CD SEM and applied it to monitor contact etching processes. As the design rule shrinks, monitoring of the contact etching, which cannot be detected by the conventional optical inspection systems, are becoming one of the most critical issues in semiconductor processing. Though there are e-beam based inspection systems or manual inspection sequence with in-line SEM (Scanning Electron Microscope), monitoring small and electrical defects has a few fundamental limitations. E-beam inspection systems have low throughput and a high price as a mass production tool. In the case of the manual inspection system, the inspection result depends on the operator and it is difficult to quantify the defect data. We have developed an automated contact inspection system to overcome these limitations. The system is composed of a data processing system and an in-line SEM. The automated in-line SEM inspects and stores the images of specified points on the wafer. The data processing system receives and manipulates the images to indicate the etching problem. It was shown that the scanning electron image of the contact is related to failures such as insufficient etching or residuals inside the contact.