Control Strategy for Wafer-Edge Defects

Identifying and resolving systematic process issues on edge die before they migrate to interior die prevents production yield loss and enables faster yield ramp. Inspections that include complete wafer information--both full and partial die--provide engineers with a comprehensive picture of a partic...

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Bibliographic Details
Published inSemiconductor International Vol. 32; no. 6; p. 22
Main Authors Hsu, M F, Yang, J H, Yang, E, Chen, H, M. Ng, M. Li, Perry-Sullivan, C
Format Magazine Article Trade Publication Article
LanguageEnglish
Published Newton Reed Business Information, Inc. (US) 01.06.2009
Reed Business Information, a division of Reed Elsevier, Inc
Subjects
Defects
Inspection
Inspections
Process engineering
Semiconductor industry
Semiconductor production equipment industry
Semiconductors
Strategic management
United States
Taiwan
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Summary:Identifying and resolving systematic process issues on edge die before they migrate to interior die prevents production yield loss and enables faster yield ramp. Inspections that include complete wafer information--both full and partial die--provide engineers with a comprehensive picture of a particular process and the associated defectivity.
ISSN:0163-3767