Characterization of anodic films formed on copper in 0.1 M borax solution

The duplex copper oxide layer formation process in 0.1 M borax solution has been investigated using different potential/time programs, open circuit potential decay, electrochemical impedance spectroscopy (EIS) and scanning electron microscopy (SEM). The importance of time in the stability attained b...

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Bibliographic Details
Published inJournal of electroanalytical chemistry (Lausanne, Switzerland) Vol. 624; no. 1; pp. 262 - 268
Main Authors Ribotta, S.B., La orgia, L.F., Gassa, L.M., Folquer, M.E.
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier B.V 01.12.2008
Elsevier
Subjects
Borax solution
Chemistry
Copper
Electrochemical impedance spectroscopy
Electrochemistry
Electrodes: preparations and properties
Exact sciences and technology
General and physical chemistry
Other electrodes
Oxide films
SEM
Voltammetry
Voltammetry
SEM
Borax solution
Copper
Oxide films
Electrochemical impedance spectroscopy
Scanning electron microscopy
Oxide layer
Rotating disk electrode
Transition metal
Borax
Surface structure
Characterization
Morphology
Anodic oxide
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Summary:The duplex copper oxide layer formation process in 0.1 M borax solution has been investigated using different potential/time programs, open circuit potential decay, electrochemical impedance spectroscopy (EIS) and scanning electron microscopy (SEM). The importance of time in the stability attained by the different oxide species was underscored. The diffusional processes involved in the duplex layer formation and oxide thickness values dependent on experimental conditions were characterized and estimated respectively through EIS data.
ISSN:1572-6657
1873-2569
DOI:10.1016/j.jelechem.2008.09.015