Organic–inorganic hybrid materials based on the incorporation of nanoparticles of polysilicic acid (nPSA) with organic polymers: 2. Curing of unsaturated poly(amide-ester) resin in the presence of nPSA

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 367; no. 1; pp. 205 - 217
• Main Authors: Hsu, Y.G., Chang, L.F., Wang, C.P.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 25.02.2004; Elsevier
• Subjects: Applied sciences; Composites; Curing shrinkage; Exact sciences and technology; Forms of application and semi-finished materials; Nanoscaled polysilicic acid; Organic–inorganic hybrid; Polymer industry, paints, wood; Technology of polymers; Unsaturated poly(amide-ester); Curing shrinkage; Unsaturated poly(amide-ester); Nanoscaled polysilicic acid; Organic–inorganic hybrid; Hybrid material; Polyesteramide; Condensation polymerization; Organic-inorganic hybrid; Shrinkage; Esteramide copolymer; Experimental study; Property processing relationship; Silica; Composite material; Crosslinked copolymer; Dynamic mechanical properties; Preparation; Acrylamide copolymer; Concentration effect; Reaction mechanism; Nanocomposite; Unsaturated polymer; Radical copolymerization
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2003.10.247

Two types of transparent organic–inorganic hybrid materials have been prepared through heat curing of N, N-dimethylacrylamide (NDMA) solution of unsaturated poly(amide-ester) (UPAE) resin (UPAE/NDMA resin) in the presence of nanoscaled polysilicic acid (nPSA) and G-nPSA obtained by modification of nPSA with 3-glycidyloxypropyltrimethoxysilane (GPTS). The curing reaction and interfacial behavior of the hybrids were studied by infrared and NMR spectroscopy. The presence of nPSA and G-nPSA enhanced the thermal properties and dynamic mechanical properties of the hybrids, and the property enhancement was particularly evident for G-nPSA containing system because of the existence of the additional COC covalent bonding between the organic and inorganic phases. The curing shrinkage of UPAE/NDMA/nPSA and UPAE/NDMA/G-nPSA hybrids reduced with the increasing of nPSA and G-nPSA contents.