The temperature dependence of resistivity and solidifying process of Al63Cu27Sn10 alloy

• Published in: Journal of molecular liquids Vol. 227; pp. 291 - 294
• Main Authors: Ma, Yuyao, Jia, Peng, Geng, Haoran, Yang, Zhongxi, Zuo, Min
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.02.2017
• Subjects: Immiscible alloy; Liquid phase separation; Resistivity; Solidifying process; The core-shell structure; The core-shell structure; Solidifying process; Liquid phase separation; Resistivity; Immiscible alloy
• ISSN: 0167-7322; 1873-3166
• DOI: 10.1016/j.molliq.2016.12.031

Liquid structure of alloys has a remarkable influence on the microstructure and mechanical properties of solidifying alloy. Resistivity, as one of the sensitive physical properties to microstructure and macrostructure, plays a very important role in the research of liquid structure and can reflect the electronic transport properties. In this paper, the liquid structure and electronic transport properties of Al63Cu27Sn10 alloy have been investigated to explore its liquid phase separation and solidification process. In the heating and cooling process, there is good superposition and consistency of the ρ-T curves and DSC curves, which verifies the accuracy of resistivity method. The results show that monotectic reaction occurs at 575°C, and the range of the immiscible area is from 530°C to 635°C for Al63Cu27Sn10 alloy. Under conventional casting condition, the microstructure of Al63Cu27Sn10 immiscible alloy melt and the solidifying process were discussed by differential scanning calorimetry (DSC), thermal analysis method (TAM), X-ray diffraction (XRD), scanning electron microscopy (SEM). The results show that: Al63Cu27Sn10 alloy dose occur liquid phase separation at the range from 530°C to 635°C, and the small volume phase rich Sn droplets tends to gather to the middle to form the core-shell structure. •Obvious monotectic reaction occurs at 575°C on ρ-T curves of Al63Cu27Sn10 alloy.•The range of the immiscible area is from 530°C to 635°C.•The changes of ρ-T curves reflect accurately the electronic transport properties and solidifying process.•Al63Cu27Sn10 alloy tends to form the core-shell structure of Al-Cu rich phase package on the Sn rich phase.