Large‐Scale N‐Type FET and Homogeneous CMOS Inverter Array Based on Few‐Layer MoTe2

• Published in: Advanced electronic materials Vol. 9; no. 10
• Main Authors: Cheng, Zhixuan, Jia, Xionghui, Cheng, Xing, Song, Yiwen, Ran, Yuqia, Li, Minglai, Xu, Wanjin, Li, Yanping, Ye, Yu, Dai, Lun
• Format: Journal Article
• Language: English
• Published: Seoul John Wiley & Sons, Inc 01.10.2023; Wiley-VCH
• Subjects: 2D integration; Arrays; Basic oxides; Chemical vapor deposition; CMOS; CMOS inverters; Contact resistance; Controllability; Deposition; Electrodes; Electron density; Electrons; few‐layer MoTe2; Field effect transistors; Inverters; Microscopy; Molybdenum compounds; Nanoelectronics; n‐type doping; Silicon; Single crystals; Tellurides
• ISSN: 2199-160X; 2199-160X
• DOI: 10.1002/aelm.202300268

2D MoTe2 is regarded as a favorable candidate for semiconductor nanoelectronics integration. Chemical‐vapor‐deposition‐grown MoTe2 usually presents p‐type characteristics. In order to realize basic electronic units like complementary metal‐oxide‐semiconductor (CMOS) inverter, controllable fabrication of p‐ and n‐type transistors at large scale is of vital importance. Here, large‐scale MoTe2 n‐channel field‐effect transistor (n‐FET) arrays are successfully fabricated with seamless coplanar metallic 1T′‐WTe2 contacts to reduce contact resistance. High‐k HfO2 serves as a gate dielectric and its atomic‐layer‐deposition (ALD) process causes an n‐doping effect on the 2H‐MoTe2 channel. The FETs perform typical n‐type characteristics with average electron density and on/off ratio of ≈1.7 × 1013 cm−2 and 2.1 × 104, respectively. Furthermore, large‐scale homogeneous CMOS inverter arrays are fabricated, showing clear logic swing with low power consumption (≈0.4 nW) and high device yield (≈92%). Notably, their voltage transfer characteristics exhibit small hysteresis, and they work well after being kept in air for 16 months, indicating high device stability. The statistical results show that both the n‐FETs and CMOS inverters have high uniformity and reliability in performance. Significantly, this fabrication method is free from transfer processes and compatible with traditional silicon technology. This work paves the way for the application of few‐layer MoTe2 in semiconductor nanoelectronics integration.