WS2 Film by Sputtering and Sulfur-Vapor Annealing, and its pMISFET With TiN/HfO2 Top-Gate Stack, TiN Bottom Contact, and Ultra-Thin Body and Box

A layered polycrystalline WS 2 film is formed by radio-frequency (RF) magnetron sputtering and sulfur-vapor annealing (SVA). Its <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MISFET is successfully demonstrated with TiN/HfO 2 top-gate sta...

Full description

Saved in:
Bibliographic Details
Published inIEEE journal of the Electron Devices Society Vol. 9; pp. 1117 - 1124
Main Authors Hamada, Takuya, Hamada, Masaya, Igarashi, Satoshi, Horiguchi, Taiga, Muneta, Iriya, Kakushima, Kuniyuki, Tsutsui, Kazuo, Tatsumi, Tetsuya, Tomiya, Shigetaka, Wakabayashi, Hitoshi
Format Journal Article
LanguageEnglish
Published IEEE 2021
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A layered polycrystalline WS 2 film is formed by radio-frequency (RF) magnetron sputtering and sulfur-vapor annealing (SVA). Its <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MISFET is successfully demonstrated with TiN/HfO 2 top-gate stack, TiN contact, and ultra-thin body and box technologies. A WS 2 film with a (002) plane is formed parallel to a substrate surface using RF magnetron sputtering, and its crystallinity is drastically enhanced by the SVA. <inline-formula> <tex-math notation="LaTeX">I </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">V </tex-math></inline-formula> characteristics with <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>-type operation are confirmed in WS 2 MISFETs with a maximum field effect mobility of <inline-formula> <tex-math notation="LaTeX">1.5\times10 </tex-math></inline-formula> −2 cm 2 V −1 s −1 . Therefore, our film-formation method is a promising candidate for <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MOSFETs in CMOS circuits.
ISSN:2168-6734
DOI:10.1109/JEDS.2021.3108882