WS2 Film by Sputtering and Sulfur-Vapor Annealing, and its pMISFET With TiN/HfO2 Top-Gate Stack, TiN Bottom Contact, and Ultra-Thin Body and Box
A layered polycrystalline WS 2 film is formed by radio-frequency (RF) magnetron sputtering and sulfur-vapor annealing (SVA). Its <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MISFET is successfully demonstrated with TiN/HfO 2 top-gate sta...
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Published in | IEEE journal of the Electron Devices Society Vol. 9; pp. 1117 - 1124 |
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Main Authors | , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
2021
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Subjects | |
Online Access | Get full text |
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Summary: | A layered polycrystalline WS 2 film is formed by radio-frequency (RF) magnetron sputtering and sulfur-vapor annealing (SVA). Its <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MISFET is successfully demonstrated with TiN/HfO 2 top-gate stack, TiN contact, and ultra-thin body and box technologies. A WS 2 film with a (002) plane is formed parallel to a substrate surface using RF magnetron sputtering, and its crystallinity is drastically enhanced by the SVA. <inline-formula> <tex-math notation="LaTeX">I </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">V </tex-math></inline-formula> characteristics with <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>-type operation are confirmed in WS 2 MISFETs with a maximum field effect mobility of <inline-formula> <tex-math notation="LaTeX">1.5\times10 </tex-math></inline-formula> −2 cm 2 V −1 s −1 . Therefore, our film-formation method is a promising candidate for <inline-formula> <tex-math notation="LaTeX">p </tex-math></inline-formula>MOSFETs in CMOS circuits. |
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ISSN: | 2168-6734 |
DOI: | 10.1109/JEDS.2021.3108882 |