Relationship among processing technology, microstructure and properties of Cu-Ni-Si alloy prepared by temperature controlled mold continuous casting and mechanism

• Published in: Cai liao gong cheng = Journal of materials engineering Vol. 47; no. 10; pp. 44 - 52
• Main Authors: Liao, Wan-neng, Liu, Xue-feng, Wang, Si-qing
• Format: Journal Article
• Language: Chinese
• Published: Beijing Beijing Institute of Aeronautical Materials 01.10.2019; Journal of Materials Engineering
• Subjects: Aging (natural); Cold rolling; Columnar structure; Continuous casting; Copper; Copper base alloys; cu-ni-si alloy; Electrical resistivity; Grain boundaries; Grain structure; influence mec-hanism; Mechanical properties; Microstructure; microstructure and property; Molds; Nickel; processing technology; Rolling direction; tcmcc; Temperature; Tensile strength; Work hardening
• ISSN: 1001-4381; 1001-4381
• DOI: 10.11868/j.issn.1001-4381.2018.000905

Temperature controlled mold continuous casting (TCMCC) technology was used to produce C70250 copper alloy strips. The strips were cold rolled and aged at different temperatures and time. The relationships among processing technology, microstructure, mechanical properties and electrical conductivity were investigated to reveal the mechanism. The results show that the C70250 copper alloy strips prepared by TCMCC have coarse columnar grain structure with less transverse grain boundaries. After cold rolling with the deformation of 97.5%, the fibrous microstructure is formed along the rolling direction. When the aging temperature and the aging time are 450℃ and 60min, the tensile strength and the electrical conductivity of the alloy are 758MPa and 54.5%IACS. Compared with the alloy prepared by traditional process, the tensile strength and the electrical conductivity increase by 5.3% and 36.3% respectively, which means the strength and electrical conductivity are improved simultaneously. Under this condition, the a