Deposition of Al/Cu Multilayer By Double Targets Cylindrical DC Magnetron Sputtering System

• Published in: Journal of nanostructures Vol. 3; no. 4; pp. 443 - 451
• Main Authors: P. Balashabadi, Z. Assadollahi, M. Ghasemi, H. Bakhtiari, E. Jafari-Khamse
• Format: Journal Article
• Language: English
• Published: Nanoscience and Nanotechnology Research Center, University of Kashan 01.12.2013
• Subjects: Coater; Magnetron sputtering; Multilayer; Thin film
• ISSN: 2251-7871; 2251-788X
• DOI: 10.7508/jns.2013.04.009

A cylindrical direct current magnetron sputtering coater with two targets for deposition of multilayer thin films and cermet solar selective surfaces has been constructed. The substrate holder was able to rotate around the target for obtaining the uniform layer and separated multilayer phases. The Al/ Cu multilayer film was deposited on the glass substrate at the following conditions: Working gas = Pure argon, Working pressure = 1 Pa, Cathode current = 8 A and cathode voltage = -600 V .Microstructure of the film was investigated by X-Ray Diffraction and the scanning electron microscopy analyses. The elements profile was determined by glow discharge–optical emission spectroscopy analysis. During deposition, both targets with magnetron configuration were sputtered simultaneously by argon ions. A Plasma column on the targets surface was generated by a 290 G permanent magnet unit. Two DC power supply units with three phases input and maximum output of 12 A/1000V were used to deposit the multilayer thin films. A control phase system was used to adjust output voltage.