Effects of Chloride Ion on Accelerator and Inhibitor during the Electrolytic Cu Via-Filling Plating

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Bibliographic Details
Published inJournal of the Korean institute of surface engineering Vol. 46; no. 4; pp. 158 - 161
Main Authors Yu, Hyun-Chul, Cho, Jin-Ki
Format Journal Article
LanguageEnglish
Published 31.08.2013
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ISSN:1225-8024
DOI:10.5695/JKISE.2013.46.4.158