56th Electronic Components and Technology Conference (ECTC 2006)

Provides notice of upcoming conference events of interest to practitioners and researchers.

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Bibliographic Details
Published inIEEE transactions on advanced packaging Vol. 29; no. 2; p. 376
Format Journal Article
LanguageEnglish
Published New York IEEE 01.05.2006
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Online AccessGet full text
ISSN1521-3323
1557-9980
DOI10.1109/TADVP.2006.876013

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Summary:Provides notice of upcoming conference events of interest to practitioners and researchers.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 14
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2006.876013