Amorphous SiO 2 Surface Irregularities and their Influence on Liquid Molecule Adsorption by Molecular Dynamics Analysis

As the semiconductor industry relentlessly reduces device sizes, efficient and precise cleaning processes have become increasingly critical to address challenges such as nanostructure stiction. Gaining insight into the molecular behavior of water and isopropyl alcohol (IPA) on silicon dioxide (SiO 2...

Full description

Saved in:
Bibliographic Details
Published inECS journal of solid state science and technology Vol. 12; no. 8; p. 83003
Main Authors Takayanagi, Masayoshi, Fujiwara, Naozumi, Seki, Ryuichi, Sato, Masanobu, Okuno, Yasutoshi
Format Journal Article
LanguageEnglish
Published 01.08.2023
Online AccessGet full text

Cover

Loading…
More Information
Summary:As the semiconductor industry relentlessly reduces device sizes, efficient and precise cleaning processes have become increasingly critical to address challenges such as nanostructure stiction. Gaining insight into the molecular behavior of water and isopropyl alcohol (IPA) on silicon dioxide (SiO 2 ) surfaces is essential for controlling semiconductor wet cleaning processes. This study investigated the interactions between these liquids and SiO 2 surfaces. Using molecular dynamics (MD) simulations, we examined the adsorption behavior of water and IPA molecules on both amorphous and crystalline SiO 2 (a-SiO 2 and c-SiO 2 ) surfaces. Our findings reveal a preferential adsorption of water molecules on a-SiO 2 surfaces compared to c-SiO 2 . This preference can be ascribed to the irregularity of the a-SiO 2 surface, which results in the presence of silanol groups that remain inaccessible to the liquid molecules. In contrast, the c-SiO 2 surface exhibits a more uniform and accessible structure. This study not only imparts crucial insights into the molecular behavior of water and IPA on SiO 2 surfaces but also provides valuable information for future enhancements and optimization of semiconductor wet surface preparation, cleaning, etching and drying.
ISSN:2162-8769
2162-8777
DOI:10.1149/2162-8777/acec0e