Low Temperture Au-Au Thermal Compression Bonding of Thermally Mismatched Substrates

Saved in:
Bibliographic Details
Published inMeeting abstracts (Electrochemical Society) Vol. MA2008-02; no. 33; p. 2211
Main Authors Farrens, Shari, Sood, Sumant
Format Journal Article
LanguageEnglish
Published 29.08.2008
Online AccessGet full text

Cover

More Information
ISSN:2151-2043
2151-2035
DOI:10.1149/MA2008-02/33/2211