Wet Etching of Amorphous TiO 2 Thin Films Using H 3 PO 4 –H 2 O 2 Aqueous Solution

We report on the wet etching of amorphous undoped and Nb-doped TiO 2 thin films using H 3 PO 4 –H 2 O 2 etching solution. The etching rate ( R ) showed a maximum at a H 3 PO 4 concentration of approximately 50 wt % at 80 °C, suggesting that H 2 PO 4 - and/or H 3 O + is responsible for the etching re...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 52; no. 9R; p. 98002
Main Authors Okazaki, Sohei, Ohhashi, Takuya, Nakao, Shoichiro, Hirose, Yasushi, Hitosugi, Taro, Hasegawa, Tetsuya
Format Journal Article
LanguageEnglish
Published 01.09.2013
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Summary:We report on the wet etching of amorphous undoped and Nb-doped TiO 2 thin films using H 3 PO 4 –H 2 O 2 etching solution. The etching rate ( R ) showed a maximum at a H 3 PO 4 concentration of approximately 50 wt % at 80 °C, suggesting that H 2 PO 4 - and/or H 3 O + is responsible for the etching reaction. The addition of H 2 O 2 to H 3 PO 4 solution significantly enhanced R , and an optimized solution exhibited an R of 13 nm/min at 80 °C, which is one order of magnitude higher than that using H 2 SO 4 . These results demonstrate that H 3 PO 4 –H 2 O 2 aqueous solution is an effective etchant for TiO 2 -based amorphous thin films.
ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.52.098002