Characterization of V T ‐instability in enhancement‐mode Al 2 O 3 ‐AlGaN/GaN MIS‐HEMTs

Abstract The threshold voltage ( V T ) instability of metal‐insulator‐semiconductor high electron mobility transistors (MIS‐HEMTs) is investigated. In the enhancement‐mode AlGaN/GaN MIS‐HEMT fabricated by fluorine plasma implantation technique featuring Al 2 O 3 gate dielectric, a hysteresis of 0.6...

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Bibliographic Details
Published inPhysica status solidi. C Vol. 10; no. 11; pp. 1397 - 1400
Main Authors Lu, Yunyou, Yang, Shu, Jiang, Qimeng, Tang, Zhikai, Li, Baikui, Chen, Kevin J.
Format Journal Article
LanguageEnglish
Published 01.11.2013
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Summary:Abstract The threshold voltage ( V T ) instability of metal‐insulator‐semiconductor high electron mobility transistors (MIS‐HEMTs) is investigated. In the enhancement‐mode AlGaN/GaN MIS‐HEMT fabricated by fluorine plasma implantation technique featuring Al 2 O 3 gate dielectric, a hysteresis of 0.6 V in transfer characteristics is observed by quasi‐static I ‐ V (current‐voltage) measurement, in which the gate bias is swept at a low rate (0.7 V/s). Pulsed transfer characteristics measurement, however, unveils much larger hysteresis under the same gate voltage swing. The V T ‐instability is attributed to the traps located at the dielectric/III‐nitride interface as well as in the bulk of gate dielectric. It is proposed that pulsed measurement can count for the effect of fast traps (shallow traps) while the quasi‐static measurement can only reflect slow traps (deep traps), and is more accurate for V T ‐instability evaluation. In addition, the existence of bulk traps is implied by a slow time‐dependent shift of V T under large gate bias. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
ISSN:1862-6351
1610-1642
DOI:10.1002/pssc.201300270