Tailoring Gold Plating for Thermal-Compression Bonding
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Published in | Meeting abstracts (Electrochemical Society) Vol. MA2013-01; no. 25; p. 994 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
08.03.2013
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Online Access | Get full text |
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ISSN: | 2151-2043 2151-2035 |
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DOI: | 10.1149/MA2013-01/25/994 |