Preparation and Properties of Ru and RuO 2 Thin Film Electrodes for Ferroelectric Thin Films

Ru and RuO 2 thin films were prepared by RF magnetron sputtering. The crystalline structure and electrical properties of these films were investigated. Reactive sputtering of a ruthenium metal target was carried out in a mixed gas of argon and oxygen at 580° C. Total pressure ( P O 2 + P Ar ) was co...

Full description

Saved in:
Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 33; no. 9S; p. 5223
Main Authors Maiwa, Hiroshi, Ichinose, Noboru, Kiyoshi Okazaki, Kiyoshi Okazaki
Format Journal Article
LanguageEnglish
Published 01.09.1994
Online AccessGet full text

Cover

Loading…
More Information
Summary:Ru and RuO 2 thin films were prepared by RF magnetron sputtering. The crystalline structure and electrical properties of these films were investigated. Reactive sputtering of a ruthenium metal target was carried out in a mixed gas of argon and oxygen at 580° C. Total pressure ( P O 2 + P Ar ) was controlled to maintain a constant pressure of 1 Pa. The RuO 2 single phase could be obtained when P O 2 was 0.5 Pa and the deposition rate was about 30 nm/min. The resistivity of the 290 nm-thick RuO 2 thin films deposited on SiO 2 (1000 nm)/Si was 54.9 µ Ω· cm. However, the resistivity increased with decreasing film thickness. Fatigue resistance of (Pb, La)TiO 3 thin films with RuO 2 as top and bottom electrodes was improved compared to the films on Pt electrodes.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.33.5223